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Advanced Flip Chip Packaging

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Advanced Flip Chip Packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Country USA
Brand Springer
Manufacturer Springer
Binding Hardcover
ItemPartNumber 9469625
ReleaseDate 2013-03-21
UnitCount 1
EANs 9781441957672

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Country	USA
Brand	Springer
Manufacturer	Springer
Binding	Hardcover
ItemPartNumber	9469625
ReleaseDate	2013-03-21
UnitCount	1
EANs	9781441957672