Advances In 3D Integrated Circuits And Systems (Emerging

Advances In 3D Integrated Circuits And Systems (Emerging Technologies in Circuits and Systems)

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D Tsv and 2.5D Tsi; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Country USA
Brand World Scientific Publishing Company
Manufacturer Wspc
Binding Paperback
ReleaseDate 2015-08-28
UnitCount 1
EANs 9789814699013

Country	USA
Brand	World Scientific Publishing Company
Manufacturer	Wspc
Binding	Paperback
ReleaseDate	2015-08-28
UnitCount	1
EANs	9789814699013

Advances In 3D Integrated Circuits And Systems (Emerging Technologies in Circuits and Systems)