Aluminum Heat Sink Module Cooler Fin for High Power Amplifier

Aluminum Heat Sink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 19 pcs Fins 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)
- [Easy Installation] This heatsink comes ready to use with no assembly required. its standard size 300x140x20mm (11.81x5.51x0.78 inches) fits most high power led setups making it a convenient and reliable cooling solution for diy enthusiasts and professionals alike.
- [Efficient Heat Dissipation] Designed to maximize surface area in with cool air this heatsink significantly reduces the risk of led light failure due to overheating. it ensures consistent performance and longevity for your high power led lights and other electronic components.
- [Lightweight and Versatile] Weighing just 570g this heatsink is for applications where weight is a concern. its compact size and lightweight design make it ideal for use in household led lights fish tank led devices and various electronic cooling solutions.
- [Optimal Performance] Specially engineered for high power led lights this heatsink can accommodate 8pcs 3w leds or 20pcs 1w leds. its 19 fins design enhances heat dissipation ensuring your devices remain cool and efficient during prolonged use.
- [Premium Aluminum Construction] Crafted from aluminum this heatsink ensures excellent thermal conductivity and durability. its robust design effectively dissipates heat keeping your electronic devices cool and functioning optimally even under heavy usage.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Specifications:
100% Brand New High Quality
Material: Aluminum
Fins: 19
Size: 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)
Quantity: 1
Weight: 157g (approx.)
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Package:
1x Aluminum Heat Sink Cooling Fin
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Note:
1. Â Â Â Please check the specification table and make sure that the size of the heatsink fits that of your component. Thank You!
2. Â Â Â Please allow 1-3mm error due to manual measurement. Thanks for your understanding.
3. Â Â Â Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
Country USA
Brand Walfront
Manufacturer walfront
Binding Misc.
ItemPartNumber 43272-950
Model NA
Size 300 mm (L) x 140 mm (W) x 20 mm (H)
UnitCount 1
UPCs 736691271961
EANs 0736691271961
ReleaseDate 0000-00-00

Country	USA
Brand	Walfront
Manufacturer	walfront
Binding	Misc.
ItemPartNumber	43272-950
Model	NA
Size	300 mm (L) x 140 mm (W) x 20 mm (H)
UnitCount	1
UPCs	736691271961
EANs	0736691271961
ReleaseDate	0000-00-00

Aluminum Heat Sink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 19 pcs Fins 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)

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