☰

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

R 3,962

or 4 x payments of R990.50 with Payflex

Availability: Currently in Stock

Delivery: 10-20 working days

Area Array Packaging Processes: for BGA, Flip Chip, and CSP

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Country USA
Brand MCGRAW-HILL PROFESSIONAL
Manufacturer McGraw-Hill Professional
Binding Hardcover
UPCs 639785505525
EANs 0000071428291
ReleaseDate 0000-00-00

Customers who purchased this also purchased....

ARSUXEO Outdoor Sports MTB Cycling Shorts Black Size X-Large

GANAZONO 200pcs 304 Stainless Steel Countersink Flat Head Washers Recessed Locking Gaskets for Mechanical Fastening and Industrial Use

12V 200A Contactor Relay with ABS Plastic and Metal Housing for Automotive Oil Pump Applications

Hike Shoes Footwear Barefoot Womens,Pro Barefoot Shoes,Wide Toe Box Healthy & Non-Slip Barefoot Outdoor Shoes Unisex Black

LCCL NovaStar LED Control Card Sending Card MSD300

NP-FV100 NP-FV100(A) High Capacity 'Intelligent' Replacement Battery

Sensodyne Rapid Relief Sensitive Toothpaste, Cavity Prevention and Sensitive Teeth Treatment - 3.4 Ounces (Pack of 2)

Durable Sandbag V3 by CERBERUS Strength