BSFF

Thermal Paste 2g Advanced Formula for CPU GPU IC & Heatsinks

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R 1,133
In stock
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Delivered in 10–20 working days —
Free shipping with 3 or more products in your cart
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Returns support
30-day return window

Description

  • SAFE APPLICATION: Metal-free and non-conductive design eliminates the risk of short circuits while providing added protection for CPU and VGA cards.
  • BETTER THAN LIQUID METAL: Made with carbon microparticles, this thermal paste provides excellent thermal conductivity, helping transfer heat away from CPU/GPU quickly and efficiently.
  • HIGH DURABILITY: The upgraded thermal paste formula provides excellent heat dissipation performance and stable thermal management, helping systems maintain reliable performance under demanding workloads.
  • EXCELLENT PERFORMANCE: Compared with metal and silicon-based thermal conductive adhesives, BSFF thermal paste maintains consistent performance over time. Once properly applied, it provides reliable thermal transfer for long-term use.
  • EASY TO APPLY: Featuring an improved formula and ideal consistency, the thermal paste spreads smoothly and evenly. The included toolkit helps with precise application, making it simple for both beginners and experienced users.
Shipping & Delivery

Your order is shipped from the USA and delivered to your door in South Africa in 10–20 working days. All items are fully tracked.

Returns & Exchanges

We offer a 30-day return window. If something isn't right, contact our support team and we'll make it right.