Brand Name RL-007GA BGA Pad Rework Kit for Phone IC Repair, Flying Line Patch Soldering Piece, Mobile Phone Motherboard Maintenance, PCB Solder Pad Welding Tool
R 910
or 4 x payments of R227.50 with
Availability: Currently in Stock
Delivery: 10-20 working days
Brand Name RL-007GA BGA Pad Rework Kit for Phone IC Repair, Flying Line Patch Soldering Piece, Mobile Phone Motherboard Maintenance, PCB Solder Pad Welding Tool
BGA Pad Rework: Perfect for mobile phone IC spot soldering and BGA PCB pad repair with copper wire construction providing lasting performance and seamless integration without trace
Complete Repair Solution: Includes 1 solder tab with over 100 different shaped solder points for comprehensive motherboard flying wire supplementary welding and drop point traceless restoration
Easy Application Process: Simply peel off the protective layer for immediate use with reinforced retaining pins that insure the pads remain securely attached during all repair operations
Enhanced Welding Performance: Excellent flatness virtual welding caused by unevenness while improving maintenance efficiency with professional-grade results every time
Versatile Compatibility: Suitable for various electronic devices requiring pad rework with dimensions of approximately 4.8*5.8 cm/2*2.3 inches making it a essential tool for technicians