Industrial & Scientific > Adhesives, Sealants & Lubricants > Silicone Adhesives

Clear Electronic Grade Silicone - 10.2 oz Cartridge

Product ID: B0063U2RPW Condition: New

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Product Description

Clear Electronic Grade Silicone - 10.2 oz Cartridge

This electronic grade silicone is a one-part, moisture- curing RTV (room temperature vulcanizing) silicone sealant/adhesive that is non-slump and cures to form a tough, permanently flexible rubber.
The non-corrosive curing system of this electronic grade silicone makes it ideally suited for protecting, sealing and insulating corrosion-sensitive electronic and electrical materials such as copper, brass, silver, etc.
Specifically formulated for use in electrical/electronic production and assembly.
This electronic grade silicone is a neutral-cure silicone that emits no objectionable odors during cure and is ideally suited for use in confined areas. However, adequate ventilation should be provided when used in large-scale production.
100% silicone and has excellent resistance to temperature changes from -57 C to +204°C (-70°F to +400°F)

SURFACE PREPARATION

All surfaces should be clean and dry. It is recommended that bonding surfaces be solvent wiped with oil-free solvents, such as xylol, toluol naphtha or non-flammable chlorinated solvents. Do not wipe with oil-based solvents such as Varsol. Allow surface to dry thoroughly before applying sealant.

DIRECTIONS

This electronic grade siliconeÂ is ready to use and requires no mixing or additives. The cure mechanism begins as soon as the sealant comes in contact with the air. At conditions of 25 C (77Â° F) and 50% relative humidity, the sealant will skin in 15 minutes and fully cure within 48 hours (1/8 bead).

Higher humidity accelerates cure. Tooling should be done before skinning takes place.

In applications where partial total confinement of sealant is prevalent, the time required for proper cure is lengthened by the degree of confinement.

PRIMING

Priming of the electronic grade siliconeÂ is normally not required for application to most substrates.

Unprimed adhesion can be readily tested by applying a small trial bead and allowing 7 days for maximum adhesion to occur.