Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)
Product Description
Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)
- Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
- Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
- Double-sided Adhesive: Provides seamless and secure contact between surfaces
- Versatile and Easy Application: Easily cut to the perfect size for your application
Technical Specifications
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