Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Product ID: 9819568900
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Product Description
Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
ReleaseDate
2026-05-01T00:00:01Z
UnitCount
1
EANs
9789819568901
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