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EGC High-Performance Thermal Paste Compound for CPU Heatsinks - 4 Grams

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EGC High-Performance Thermal Paste Compound for CPU Heatsinks - 4 Grams
- High-performance thermal compound maximizes thermal conductivity
- Easy to apply with the included application-stick
- Thermal conductivity: > 5.15 W/mk
- Perfect for enthusiasts and system-builders looking looking for optimal cooling
- 45% Matal Oxide Compounds / 45% Carbon Compounds / 10% Silicone Compounds
EGC's High-Performance thermal compound is specifically tailored for system-builders looking to get the most thermal conductivity between their processor and heatsink/CPU fan. With 4G of high-density thermal compound you can cover nearly 30 CPU cores. Thermal compound has never been easier to apply with the included application-stick.

Country	USA
Brand	EGC
Manufacturer	Shenzhen Halnziye Electronics Co., Ltd.
Binding	Personal Computers
ItemPartNumber	LYSB00XJ2PDJE-ELECTRNCS
Model	EL-PN-47317870
Color	Grey
UPCs	712319999271
EANs	7445803051362
ReleaseDate	0000-00-00

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