ElecGear LGA1700 Anti-Bending Contact Frame + Liquid Metal Thermal Paste, Carbon Fiber Mod ILM for Intel Core 14, 13 and 12th LGA1700-BCF Socket, CPU Fixing Buckle with Double Leak-Proof Design

ElecGear LGA1700 Anti-Bending Contact Frame + Liquid Metal Thermal Paste, Carbon Fiber Mod ILM for Intel Core 14, 13 and 12th LGA1700-BCF Socket, CPU Fixing Buckle with Double Leak-Proof Design

Product ID: B09ZPVCKMQ Condition: New

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Product Description

ElecGear LGA1700 Anti-Bending Contact Frame + Liquid Metal Thermal Paste, Carbon Fiber Mod ILM for Intel Core 14, 13 and 12th LGA1700-BCF Socket, CPU Fixing Buckle with Double Leak-Proof Design

  • [General Info] – The kit consists of an anti-bending buckle for Intel 14, 13 and 12th CPU LGA1700-BCF socket (?Not for 15th), liquid metal thermal paste and a patent pending structure encloses the liquid inside. (?Noted: 1. The DIY takes serious skills, it’s for experts alone. 2. Never use the liquid metal with aluminum heatsink. 3. Carefully study the picture and choose an appropriate heatsink.)
  • [Carbon Fiber Contact Frame] – The bending correction frame together with the elastic gasket inside evenly distributes the pressure on the edge of IHS. The bracket ensures CPU is perfectly flat in the socket, preventing it from flexing. Double layers of sealing O-rings prevent the liquid metal from leakage. The insulating pads and the gasket are made of 130℃ materials for most stability
  • [Liquid Metal Thermal Paste] – Based on gallium, we added special materials to deliver higher thermal conductivity at 82W/m-K. This V3 edition looks not like a liquid, it’s an ice cream. 10 times superior to normal paste, easy to apply and long durability. Perfect for enthusiasts seeking for extreme performance. (Noted: ?Never use with aluminum. ?Electrically conductive, never spill on any electronic parts or PCB. ?It will solidify in winter, please warm the tube in water before use.)
  • [Bending Issue of Raptor Lake and Alder Lake] – Intel 13th and 12th CPU elongated its IHS and the stock LGA-1700 ILM placed tremendous pressure on the middle of CPU that causes the top to bend or warp. Some famous IT publisher reported this bending or warping deflection increases CPU temperatures by 5℃. Intel insists the deflection isn't a problem, but PC enthusiasts won't agree with the poor contact with a warped processor and higher temp
  • [All DIY Tools included] – A plate to extend the bottom surface of heatsink. This plate together with the O-ring encloses the liquid inside. The plate must be glued and aligned with the heatsink. We added assorted files and glue to fulfill this purpose. T20 screwdriver for replacing the stock CPU buckle. Cotton swabs, finger cuffs, small brush for apply the liquid metal. A detailed instruction demonstrating how to do the operation

Technical Specifications

Country
USA
Brand
ElecGear
Manufacturer
ElecGear
Binding
Unknown Binding
PartNumber
LGA1700-CF
Model
LGA1700-CF
Color
gray
Weight
0.2425084882