Enzotech BCC9 - Eight pack of copper heat sinks for BT878 chips
Product Description
Enzotech BCC9 - Eight pack of copper heat sinks for BT878 chips
- Pure copper design
- Heatsink for BT878 chips
- For high-heat enviroments
BCC9 is a low profile version of the bmr-c1 that has a refined fin height and base thickness. Will work with specific applications that has low clearance. Model: BCC9.
Technical Specifications
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