HengTianMei 60/40 Rosin Core Low Temp Tin Lead Solder Wire, for Soldering Electronic Devices (1.2mm/50g)
R 1,020
or 4 x payments of R255.00 with
Availability: Currently in Stock
Delivery: 10-20 working days
This item may be available in a different size, colour, scent, version or platform:
HengTianMei 60/40 Rosin Core Low Temp Tin Lead Solder Wire, for Soldering Electronic Devices (1.2mm/50g)
Rosin solder wire content parameters: Tin 60% lead 40% (Sn 60% Pb 40%), rosin flux content: 1.8%.
Electronic solder wire product parameters: Diameter 1.2mm (0.047 inch), net weight 50g (1.76 oz), melting point around 183 ℃ (361 ℉).
Low melt solder wire usage effect: A reasonable alloy content ratio and the addition of rosin flux make the solder joints firm, with a full color and luster. Excellent fluidity makes it easier for you to operate.
Solder wire application scope: The above characteristics make it suitable for soldering various electronic components and manual DIY operations.
We have a professional service team, ready to provide the best service for each customer, look forward to the start of cooperation, if you have any questions, please feel free to contact us.