IC Diamond 24 Carat 4.8 Gram Thermal Compound

IC Diamond 24 Carat 4.8 Gram Thermal Compound
- SUPERIOR THERMAL PERFORMANCE- Engineered and made by 3M corporation to meet OEM specifications for the best combination of maximum performance and durability and is packaged by Innovation Cooling for retail sale
- SUPERIOR RELIABILITY- Used in mission critical applications for the military defense sector in Aviation and Naval electronics. High/Tight particle density seals in liquids and retards fluid loss lasting 3 to 4X times typical Asian retail repacks
- INTENDED USE INCLUDE but not limited to CPU,GPU Game Stations, LED Lighting, IC Packaging, Battery Thermal Management
- Contains 92% Purified synthetic diamond micronized Diamond, a natural thermal superconductor with a conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver
- Will not pump or bake out when properly used and is neither Non capacitive or electrically conductive. C of C available on Request
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity. Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Country USA
Brand IC Diamond
Manufacturer INNOVATIVE COOLING
Binding Unknown Binding
ItemPartNumber IC Diamond 24 Carat
Model IC Diamond 24 Carat
UPCs 013964286519
EANs 0013964286519
ReleaseDate 0000-00-00

Country	USA
Brand	IC Diamond
Manufacturer	INNOVATIVE COOLING
Binding	Unknown Binding
ItemPartNumber	IC Diamond 24 Carat
Model	IC Diamond 24 Carat
UPCs	013964286519
EANs	0013964286519
ReleaseDate	0000-00-00

IC Diamond 24 Carat 4.8 Gram Thermal Compound

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