BSFF Thermal Paste, 1.8g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance
| Country | USA |
| Brand | JACK DANIELS |
| Manufacturer | JACK DANIELS |
| Binding | Grocery |
| ItemPartNumber | 00013000000543 |
| Model | 00013000000543 |
| UPCs | 013000000543 |
| EANs | 0013000000543 |
| ReleaseDate | 2017-05-22 |