Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
- Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
- New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
- New chapter on testing procedures, sample handling and sample selection, and experimental design
- Coverage of new packaging materials, including plastics and composites
Country USA
Brand Academic Press
Manufacturer Academic Press
Binding Hardcover
ItemPartNumber Illustrated
UnitCount 1
EANs 9780120885749
ReleaseDate 0000-00-00

Country	USA
Brand	Academic Press
Manufacturer	Academic Press
Binding	Hardcover
ItemPartNumber	Illustrated
UnitCount	1
EANs	9780120885749
ReleaseDate	0000-00-00

Reliability and Failure of Electronic Materials and Devices

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