Thermal Grizzly Minus Pad 8-30x30x2.0mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics
Product Description
Thermal Grizzly Minus Pad 8-30x30x2.0mm Thermal Interface Pad, Electrically Non-Conductive, High Thermal Conductivity & Compressibility for SSDs, GPUs & Electronics
- THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide
- FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity
- USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces
- GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components
- 8W/(m·K) THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements
****The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer. The lightest of touches is enough to attach them optimally. All pads are ecofriendly and RoHS-compliant.
Technical Specifications
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