Thermoelectric Cooler, Heatsink Cooling Plate Module Practical for Electronic Components for Home Appliance for Computers for Electronic Equipment
R 1,066
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Thermoelectric Cooler, Heatsink Cooling Plate Module Practical for Electronic Components for Home Appliance for Computers for Electronic Equipment
The power of a single refrigeration component pair is very small, but it is combined into a pile. If the same type of pile is used in series and parallel to form a refrigeration system, the power can be very large, so the cooling power can be up to several milliwatts. The range of ten thousand
The reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally suitable for power generation in the middle and low temperature areas.
The thermal inertia is small, and the cooling and heating time is fast. When the hot end has good heat dissipation and the cold end is empty, the cooling plate can attain the maximum temperature difference in less than one minute.
Normal temperature hot exterior can withstand temperature of 80 degrees, medium temperature hot exterior can withstand temperature of 150 degrees, high temperature hot exterior can withstand temperature of 200 degrees; the temperature difference between hot end and cold end can attain 67 degrees, level two can attain 80 degrees, level three can attain 90 degrees, the fourth level reaches 107 degrees.
Semiconductor refrigeration fins have two functions, both cooling and heating. The cooling efficiency is generally 55-60%, but the heating efficiency is always higher than 1, so using one can replace the separate cooling system and heating system.