The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The

Wafer Bonding

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Country	USA
Binding	Hardcover
EAN	9783540210498
Edition	2004
ISBN	3540210490
Label	Springer
Manufacturer	Springer
MPN	363 black & white illustrations, 20 colo
NumberOfItems	1
NumberOfPages	499
PartNumber	363 black & white illustrations, 20 colo
PublicationDate	2004-06-24
Publisher	Springer
Studio	Springer
ReleaseDate	0000-00-00

Wafer Bonding