Chip Quik SMD291SNL50T3 Solder Paste in jar 50g (T3) SAC305 no

Chip Quik SMD291SNL50T3 Solder Paste in jar 50g (T3) SAC305 no clean
- Lead-Free / RoHS Compliant
Description Solder Paste in jar 50g (T3) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 217-220C (423-428F) Size: 50g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Country USA
Brand Chip Quik
Manufacturer Chip Quik®
Binding Tools & Home Improvement
ItemPartNumber SMD291SNL50T3
Model SMD291SNL50T3
UPCs 700254127217
EANs 0700254127217
ReleaseDate 0000-00-00

Chip Quik SMD291SNL50T3 Solder Paste in jar 50g (T3) SAC305 no clean