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Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

Product ID: B07BH5LP5G Condition: New

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Product Description

Chip Quik SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

Chip Quik SMD291AX50T3 Solder Paste: Contains 50g of solder paste for SMD components
Made with Sn63/Pb37 alloy: Provides reliable electrical and thermal conductivity
No clean required: Saves time and effort in the soldering process
Compatible with most SMD components: Suitable for use in electronic devices
Made by Chip Quik: A trusted brand in electronics soldering and repair

Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.